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Speedy USB 3.0 spec to be unveiled

Posted in Windows


 

On November 17 the SuperSpeed USB (USB 3.0) Developers Conference, hosted by the USB Implementers Forum in San Jose, Calif., will unveil the USB 3.0 specification to the industry, according to a statement Wednesday from the Implementers Forum.

The USB 3.0 specification, a next-generation high-speed connection standard due in 2009, is significant because all future PCs and devices will use connectors based on it. The spec is also expected to offer 10 times the speed of USB 2.0–used in virtually all PCs introduced in the last few years–or roughly 5 gigabits per second.

Hewlett-Packard, Intel, NEC, NXP Semiconductors, Microsoft, and Texas Instruments are all backers of SuperSpeed USB.

Speaking at the Windows Hardware Engineering Conference (WinHEC) in Los Angeles, USB-IF President Jeff Ravencraft said he expects the final specifications to be made public on November 17.

While not formally unveiled, the SuperSpeed USB logo was shown at WinHEC 2008 last week where Redmond engineers held discussions on which OS will support the new USB. Windows 7 RTM unfortunately won’t ship with native USB 3.0 support; that is, if the next Windows doesn’t encounter delays. Hopefully, USB 3.0 is worth the wait with speed boost to 4.8Gbps, the use of optical cabling, and new power management. WinHEC 2008 has a a brief performance comparison sample for data transfer of 25GB HD movie:

  • USB 1.0: 9.3 hours
  • USB 2.0: 13.9 minutes
  • USB 3.0: 70 seconds

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